|
MC-Typ |
KE-760 |
|
Montagekopf |
2 Bestückköpfe (gleichzeitige Adsorption abwechselnd platzieren) |
|
Genauigkeit der Montage |
±0.03mm / chip (for laser recognition) |
|
Patch-Geschwindigkeit |
0,32 Sekunden / CHIP, 1,8 / Sekunde QFP) |
|
Größe des Substrats |
Min 330×250mm |
|
Komponenten-Sortiment |
0402~50×50mm |
|
Stromquelle |
einphasig AC220V, 50/60Hz, 2,5KVA |
|
Luftdruck und Luftverbrauch |
0.5Mpa ± 10%, 150N1/min |
|
Dimensionen |
1400 × 1300 × 1551mm |
|
Gewicht |
1150kg |
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